The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

May. 16, 2018
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Fuminobu Kitayama, Settsu, JP;

Naoto Kataoka, Settsu, JP;

Toru Yamatani, Takasago, JP;

Katsumi Yamaguchi, Takasago, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 33/12 (2006.01); C08F 265/06 (2006.01); C08J 5/18 (2006.01); G02B 1/14 (2015.01); B29C 41/26 (2006.01); B29K 33/00 (2006.01); B29C 41/28 (2006.01);
U.S. Cl.
CPC ...
C08L 33/12 (2013.01); C08F 265/06 (2013.01); C08J 5/18 (2013.01); G02B 1/14 (2015.01); B29C 41/26 (2013.01); B29C 41/28 (2013.01); B29K 2033/12 (2013.01); C08J 2333/12 (2013.01); C08J 2451/06 (2013.01); C08L 2205/18 (2013.01); C08L 2207/53 (2013.01);
Abstract

Provided is a dope used when a film containing an acrylic-based resin and a core-shell type graft copolymer is made by a solution casting method, in which turbidity is less likely to occur despite the use of a core-shell type graft copolymer having a core layer with a large particle diameter. A dope for producing a film by a solution casting method contains a thermoplastic acrylic-based resin, a graft copolymer, and a solvent. In this dope, the graft copolymer has a core layer and a shell layer, the core layer has an average particle diameter of 125 to 400 nm, the graft copolymer has a degree of swelling by methyl ethyl ketone of 3.5 or more, and the solvent has a hydrogen bonding term δH in a Hansen solubility parameter of 6.0 or more and 8.0 or less.


Find Patent Forward Citations

Loading…