The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Jun. 16, 2020
Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventor:

Minoru Morita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08K 3/04 (2006.01); C08L 63/00 (2006.01); C08K 7/06 (2006.01); B29K 507/04 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); C08K 3/041 (2017.05); C08L 63/00 (2013.01); B29K 2063/00 (2013.01); B29K 2507/04 (2013.01); C08J 2363/00 (2013.01); C08K 7/06 (2013.01); C08K 2201/001 (2013.01); C08K 2201/004 (2013.01); C08L 2201/56 (2013.01); C08L 2203/16 (2013.01);
Abstract

A method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced. A method for producing an anisotropic conductive sheet, includes a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.


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