The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Nov. 18, 2016
Applicant:
Teijin Limited, Osaka, JP;
Inventors:
Takeshi Matsuda, Osaka, JP;
Takuro Kitamura, Osaka, JP;
Assignee:
Teijin Limited, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 3/20 (2006.01); C08K 3/16 (2006.01); C08K 3/04 (2006.01); C08L 77/00 (2006.01); C08J 5/10 (2006.01); B29C 43/00 (2006.01); C08K 7/06 (2006.01); B29C 43/02 (2006.01); B29K 77/00 (2006.01); B29C 35/08 (2006.01); B29K 509/00 (2006.01); B29K 505/10 (2006.01); B29K 105/12 (2006.01); B29K 105/16 (2006.01); C08J 5/04 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
C08J 3/203 (2013.01); B29C 43/003 (2013.01); C08J 5/10 (2013.01); C08K 3/04 (2013.01); C08K 3/16 (2013.01); C08K 7/06 (2013.01); C08L 77/00 (2013.01); B29C 43/02 (2013.01); B29C 2035/0822 (2013.01); B29K 2077/00 (2013.01); B29K 2105/12 (2013.01); B29K 2105/16 (2013.01); B29K 2505/10 (2013.01); B29K 2509/00 (2013.01); B29L 2031/30 (2013.01); C08J 5/042 (2013.01); C08J 2377/02 (2013.01); C08K 2201/014 (2013.01);
Abstract
The present invention provides a method for producing a molded article by pressing a composite material containing a resin composition and carbon fibers, wherein the resin composition contains a polyamide resin, a copper compound and potassium halide, and (1) the copper compound content is 0.1 parts by mass or more relative to 100 parts by mass of the polyamide resin.