The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Aug. 08, 2019
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Scott David Hochberg, Cincinnati, OH (US);

Edward Daniel Theiss, III, Union Township, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65D 33/24 (2006.01); B65D 33/25 (2006.01); B65D 75/58 (2006.01);
U.S. Cl.
CPC ...
B65D 33/24 (2013.01); B65D 33/2508 (2013.01); B65D 75/5805 (2013.01); B65D 2313/04 (2013.01);
Abstract

A package with magnetic closure portions. The package can include a first flexible polymeric sidewall and a second flexible polymeric sidewall. The first and second flexible polymeric sidewalls can be joined by opposing first and second sides and a bottom portion and together defining an access opening. A first magnetic region can be disposed on the first sidewall. A second magnetic region can be disposed on the first sidewall. A third magnetic region can be disposed on the second sidewall. A fourth magnetic region can be disposed on the second sidewall. The first and third magnetic regions can be magnetically engageable with a magnetic force to urge at least a portion of the first and second sidewalls into contacting relationship, and the second and fourth magnetic regions can be magnetically engageable with a magnetic force to urge at least a portion of the first and second sidewalls into contacting relationship.


Find Patent Forward Citations

Loading…