The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Mar. 19, 2019
Applicant:
Rogers Corporation, Chandler, AZ (US);
Inventors:
Stephen O'Connor, West Roxbury, MA (US);
Murali Sethumadhavan, Acton, MA (US);
Assignee:
ROGERS CORPORATION, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/58 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); B29C 70/88 (2006.01); H01B 3/44 (2006.01); H01B 3/42 (2006.01); C08K 7/00 (2006.01); C08K 3/10 (2018.01); H01B 3/30 (2006.01); C08L 71/00 (2006.01); C08K 3/013 (2018.01); H01B 3/00 (2006.01); B29K 509/00 (2006.01); B29K 505/08 (2006.01); B29K 101/12 (2006.01); B29K 81/00 (2006.01); B29K 79/00 (2006.01); B29K 223/00 (2006.01); B29K 71/00 (2006.01); B29L 31/34 (2006.01); C08K 3/38 (2006.01); C08G 73/10 (2006.01); H05K 1/03 (2006.01); C08L 79/08 (2006.01); C08G 73/14 (2006.01);
U.S. Cl.
CPC ...
B29C 70/58 (2013.01); B29C 70/882 (2013.01); C08K 3/013 (2018.01); C08K 3/10 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 7/00 (2013.01); C08L 71/00 (2013.01); H01B 3/006 (2013.01); H01B 3/301 (2013.01); H01B 3/306 (2013.01); H01B 3/427 (2013.01); H01B 3/441 (2013.01); B29K 2071/00 (2013.01); B29K 2079/08 (2013.01); B29K 2081/04 (2013.01); B29K 2081/06 (2013.01); B29K 2101/12 (2013.01); B29K 2223/06 (2013.01); B29K 2505/08 (2013.01); B29K 2509/00 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/3456 (2013.01); C08G 73/1046 (2013.01); C08G 73/14 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/385 (2013.01); C08K 2201/005 (2013.01); C08L 79/08 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0266 (2013.01);
Abstract
In an embodiment, a thermoplastic composite comprises a thermoplastic polymer; and a dielectric filler having a multimodal particle size distribution; wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution; and a flow modifier.