The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Apr. 23, 2019
Fujifilm Corporation, Tokyo, JP;
Yoshiki Sakazaki, Kanagawa, JP;
Kenichiro Tamaki, Kanagawa, JP;
Toshihiro Usa, Kanagawa, JP;
Ikuo Takano, Kanagawa, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
Provided are a mold case that prevents deformation of a microneedle array, and a manufacturing method of a microneedle array. The problems are solved by the manufacturing method of a microneedle array including: a filling step of filling needle-like recessed portions of a mold having flexibility and having a plurality of the needle-like recessed portions on a front surface, with a liquid material; and a drying step of drying the liquid material in a state where the mold filled with the liquid material is stored in the mold case which causes an edge portion of the mold to be sandwiched between the lid and the pedestal.