The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Jun. 11, 2018
Applicant:
SK Siltron Co., Ltd., Gumi-si, KR;
Inventor:
Yong Choi, Seoul, KR;
Assignee:
SK Siltron Co., Ltd., Gumi-Si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/34 (2012.01); B24B 37/10 (2012.01); B24B 55/03 (2006.01); B24B 55/04 (2006.01);
U.S. Cl.
CPC ...
B24B 37/34 (2013.01); B24B 37/105 (2013.01); B24B 55/03 (2013.01); B24B 55/045 (2013.01);
Abstract
The present invention provides a wafer polishing apparatus, including: a surface plate having a polishing pad attached on an upper surface thereof; a slurry injection nozzle configured to inject slurry toward the polishing pad; at least one polishing head configured to accommodate a wafer and rotate at an upper portion of the surface plate; an index configured to support so as to connect the at least one polishing head at an upper portion thereof; and a particle suction part coupled to the index and configured to suck particles generated during polishing of the wafer.