The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2021
Filed:
Aug. 27, 2018
International Business Machines Corporation, Armonk, NY (US);
Emmanuel Delamarche, Thalwil, CH;
Yuksel Temiz, Zug, CH;
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention is notably directed to methods of fabrication of a microfluidic chip package or assembly (), comprising: providing (S) a substrate () having at least one block () comprising one or more microfluidic structures on a face (F) of the substrate; partially cutting (S) into the substrate to obtain partial cuts (), such that a residual thickness of the substrate at the level of the partial cuts () enables singulation of said at least one block (); cleaning (S) said at least one block; and applying (S-S) a cover-film () to cover said at least one block (), whereby at least one covered block is obtained, the applied cover film still enabling singulation of each covered block, wherein each covered block corresponds to a microfluidic chip after singulation. The present invention is further directed to microfluidic chips, packing or assembly, obtainable with such methods.