The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Feb. 21, 2020
Applicant:

Stemco Co., Ltd., Cheongju-si, KR;

Inventors:

Hong Man Kim, Cheongju-si, KR;

Kang Dong Kim, Seongnam-si, KR;

Won Tae Jo, Cheongju-si, KR;

Duck Jae Seo, Cheongju-si, KR;

Jung Sub Kim, Cheongju-si, KR;

Assignee:

STEMCO CO., LTD., Cheongju-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 21/4846 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 1/118 (2013.01); H05K 1/181 (2013.01); H05K 3/244 (2013.01); H05K 3/28 (2013.01); H05K 3/341 (2013.01); H05K 3/3473 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract

The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.


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