The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Jan. 23, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kouji Ishikawa, Nagaokakyo, JP;

Akio Katsube, Nagaokakyo, JP;

Takehito Ishihara, Nagaokakyo, JP;

Takeshi Ono, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H03H 9/17 (2006.01); H03H 9/15 (2006.01);
U.S. Cl.
CPC ...
H03H 9/1021 (2013.01); H03H 3/02 (2013.01); H03H 9/0519 (2013.01); H03H 9/1057 (2013.01); H03H 9/176 (2013.01); H03H 2003/022 (2013.01); H03H 2003/027 (2013.01); H03H 2009/155 (2013.01);
Abstract

An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.


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