The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Oct. 16, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Alexander N. Lerner, San Jose, CA (US);

Kim Ramkumar Vellore, San Jose, CA (US);

Steven Trey Tindel, Austin, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01); C23C 16/458 (2006.01); H01L 51/56 (2006.01); H01L 51/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); C23C 16/4586 (2013.01); H01L 21/683 (2013.01); H01L 21/6833 (2013.01); H01L 51/00 (2013.01); H01L 51/0002 (2013.01); H01L 51/56 (2013.01); C23C 16/458 (2013.01); H01L 21/67288 (2013.01);
Abstract

A chucking station comprises a chuck, a power supply, and one or more pumping elements. The chuck comprises a plurality of first vacuum ports configured to interface with a surface of a substrate and a plurality of second vacuum ports configured to interface with a surface of a carrier. The chuck further comprises a first electrical pin configured to be in electrical communication with a first electrode of the carrier, and a second electrical pin configured to be in electrical communication with a second electrode of the carrier. The power supply is configured to apply a chucking voltage and a de-chucking voltage to the first and second electrical pins. The one or more pumping elements is coupled to the first and second vacuum ports and configured to generate a vacuum between the substrate and the chuck and a vacuum between the carrier and the chuck.


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