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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11195971 B1

PDFFull Text
Date of Patent:
Dec. 07, 2021

Filed:

Aug. 18, 2020

Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate

Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Toshihiko Watanabe, Tokyo, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:

Chip Law Group

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/48 (2006.01); H05K 7/00 (2006.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/14 (2006.01); H05K 1/11 (2006.01); H01L 27/12 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 27/12 (2013.01); H01L 27/156 (2013.01); H01L 33/62 (2013.01); H05K 1/02 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 3/14 (2013.01); H05K 3/146 (2013.01); H05K 3/18 (2013.01); H05K 3/42 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A glass wiring substrate includes a glass substrate, a first wiring portion formed on a first surface of the glass substrate, a second wiring portion formed on a second surface opposite to the first surface, a through-hole formed in a region of the glass substrate in which the first wiring portion and the second wiring portion are not formed, the through-hole having a diameter on a second surface side larger than a diameter on a first surface side, and a through-hole portion formed in the through-hole, one end portion of the through-hole portion extending to the first wiring portion, the other end portion of the through-hole portion extending to the second wiring portion, in which a wiring pitch Pof the first wiring portion in the vicinity of the through-hole portion is narrower than a wiring pitch Pof the second wiring portion in the vicinity of the through-hole portion.

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