The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

May. 28, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Jung Mok Jang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4875 (2013.01); H01L 23/367 (2013.01);
Abstract

An electronic device module includes a substrate, a first device and a second device mounted on the substrate, and a shielding frame mounted on the substrate to accommodate the first device. The shielding frame includes a heat dissipating portion stacked on the first device, and posts extended from an edge of the heat dissipating portion and spaced apart from each other. A spacing distance between the posts is smaller than a wavelength of an electromagnetic wave introduced into the first device or output from the first device.


Find Patent Forward Citations

Jang, Jung. (2021). Electronic device module and method of manufacturing the same (U.S. Patent No. 11195800). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11195800

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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