The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Jun. 20, 2016
Applicants:
Zhuzhou Crrc Times Electric Co. Ltd., Hunan, CN;
Dynex Semiconductor Limited, Lincolnshire, GB;
Inventor:
Robin Adam Simpson, Lincolnshire, GB;
Assignee:
DYNEX SEMICONDUCTOR LIMITED, Hunan, GB;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 24/72 (2013.01); H01L 24/90 (2013.01); H01L 24/97 (2013.01); H01L 25/115 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
We disclose herein a semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a semiconductor unit locator comprising a plurality of holes, wherein each semiconductor unit is located in each hole of the semiconductor unit locator; a plurality of pressure means for applying pressure to each semiconductor unit, and a conductive malleable layer located between the plurality of pressure means and the semiconductor unit locator.