The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Mar. 24, 2020
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Michael Benjamin Brown, Palos Verdes Peninsula, CA (US);

Alberto F. Viscarra, Torrance, CA (US);

Michael M. Fitzgibbon, Playa Del Rey, CA (US);

John A. Crockett, Jr., Anaheim, CA (US);

Chad E. Patterson, Los Angeles, CA (US);

Kevin C. Rolston, Westchester, CA (US);

Duke Quach, San Gabriel, CA (US);

Kevin P. Agustin, Los Angeles, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H05K 7/20 (2006.01); H05K 7/10 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H05K 3/325 (2013.01); H05K 7/1061 (2013.01); H05K 7/20445 (2013.01); H05K 7/20454 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.


Find Patent Forward Citations

Loading…