The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Nov. 24, 2016
Applicants:
Audi Ag, Ingolstadt, DE;
Abb Schweiz Ag, Baden, CH;
Inventors:
Andreas Apelsmeier, Pollenfeld, DE;
Günter Vetter, Burladingen, DE;
Assignees:
AUDI AG, Ingolstadt, DE;
ABB Schweiz AG, Baden, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3738 (2013.01); H01L 21/4803 (2013.01); H01L 21/4814 (2013.01); H01L 23/147 (2013.01); H01L 23/367 (2013.01); H01L 24/36 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40139 (2013.01); H01L 2924/13055 (2013.01);
Abstract
An electronic power module, including at least one semiconductor component, which is arranged on a support, as well as a cooling element, which is in thermal contact with the semiconductor component, wherein the support includes a semiconductor material and, at the same time, serves as a cooling element.