The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Mar. 24, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Soo Hwan Lee, Suwon-si, KR;
Abstract
A semiconductor package includes a mounting substrate, a first semiconductor chip on the mounting substrate and electrically connected to the mounting substrate, a heat dissipation element on an upper surface of the first semiconductor chip, where the heat dissipation element comprises a sidewall comprising an inclined surface and an upper surface directly connected to the inclined surface, and a package molding portion on the mounting substrate and the inclined surface of the heat dissipation element. The package molding portion exposes at least a portion of the upper surface of the heat dissipation element, the upper surface of the heat dissipation element is parallel to the upper surface of the first semiconductor chip, and an angle formed by the upper surface of the heat dissipation element and the inclined surface of the heat dissipation element is an obtuse angle.