The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Apr. 03, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jae-Woong Nah, Closter, NJ (US);

Hanhee Paik, Danbury, CT (US);

Jerry M. Chow, White Plains, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/367 (2006.01); G06N 10/00 (2019.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 39/04 (2006.01); H01L 39/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); G06N 10/00 (2019.01); H01L 23/49816 (2013.01); H01L 23/544 (2013.01); H01L 24/08 (2013.01); H01L 39/045 (2013.01); H01L 39/223 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/08225 (2013.01);
Abstract

In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.


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