The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Apr. 13, 2016
Applicant:
Addibots, Llc, New Windsor, NY (US);
Inventors:
Robert A. Flitsch, New Windsor, NY (US);
Frederick A. Flitsch, New Windsor, NY (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/31 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B29C 63/06 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29C 64/386 (2017.01); E01C 23/06 (2006.01); B29C 64/106 (2017.01); B29C 64/118 (2017.01); B29C 64/20 (2017.01); B29C 64/112 (2017.01); B22F 12/00 (2021.01); B29K 21/00 (2006.01); B29K 105/00 (2006.01); B29K 621/00 (2006.01); B29L 31/00 (2006.01); B29C 64/393 (2017.01); E01C 23/01 (2006.01); E01C 23/09 (2006.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
G05B 19/31 (2013.01); B22F 12/00 (2021.01); B29C 63/06 (2013.01); B29C 64/106 (2017.08); B29C 64/112 (2017.08); B29C 64/118 (2017.08); B29C 64/20 (2017.08); B29C 64/386 (2017.08); B29C 65/48 (2013.01); B29C 66/52272 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); E01C 23/065 (2013.01); B22F 10/10 (2021.01); B22F 2999/00 (2013.01); B29C 64/393 (2017.08); B29K 2021/00 (2013.01); B29K 2105/256 (2013.01); B29K 2621/00 (2013.01); B29L 2031/757 (2013.01); B29L 2031/776 (2013.01); E01C 23/01 (2013.01); E01C 23/096 (2013.01); E01C 23/0966 (2013.01); G05B 2219/49023 (2013.01); Y02P 10/25 (2015.11);
Abstract
The present disclosure provides various aspects for mobile and automated processing utilizing additive manufacturing and the methods for their utilization and for making material dispensing element arrays for use of the additive manufacturing device.