The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Jun. 21, 2017
Applicant:
Spy Eye, Llc, Los Gatos, CA (US);
Inventors:
Eric Anthony Perozziello, Discovery Bay, CA (US);
Edward John Palen, Corte Madera, CA (US);
Michael West Wiemer, San Jose, CA (US);
Assignee:
Tectus Corporation, Saratoga, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02C 11/00 (2006.01); H05K 3/10 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 1/16 (2006.01); H05K 3/18 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01F 27/28 (2006.01); G02C 7/04 (2006.01); G02B 27/01 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H05K 3/16 (2006.01); H05K 3/14 (2006.01); H01Q 7/00 (2006.01); H01Q 9/04 (2006.01); H01Q 1/27 (2006.01); H02J 50/10 (2016.01);
U.S. Cl.
CPC ...
G02C 11/10 (2013.01); G02B 27/0172 (2013.01); G02C 7/04 (2013.01); H01F 17/0006 (2013.01); H01F 27/2804 (2013.01); H01F 41/042 (2013.01); H01Q 1/22 (2013.01); H01Q 1/273 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01); H01Q 9/04 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 3/0026 (2013.01); H05K 3/0044 (2013.01); H05K 3/107 (2013.01); H05K 3/18 (2013.01); H05K 3/182 (2013.01); H02J 50/10 (2016.02); H05K 3/146 (2013.01); H05K 3/16 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/107 (2013.01); Y02P 70/50 (2015.11);
Abstract
A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.