The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Aug. 14, 2020
Corning Incorporated, Corning, NY (US);
Kevin Wallace Bennett, Hammondsport, NY (US);
Scott Robertson Bickham, Corning, NY (US);
Ximao Feng, San Mateo, CA (US);
Wen-Lung Kuang, Taoyuan, TW;
Pushkar Tandon, Painted Post, NY (US);
Ruchi Tandon, Painted Post, NY (US);
Shudong Xiao, Fremont, CA (US);
Bryan William Wakefield, Lindley, NY (US);
Andy Fenglei Zhou, Fremont, CA (US);
Corning Incorporated, Corning, NY (US);
Abstract
The high-density FAU comprises a support substrate having a grooved front-end section that supports glass end sections of the small diameter low-attenuation optical fibers. A cover is disposed on the front-end section and secured thereto to hold the glass end sections in place. The substrate and the cover can be made of the same glass or glasses having about the same CTE. The glass end sections have a diameter d4 so that the pitch P2 of the fibers at the front end of the FAU can be equal to or greater than d4, wherein d4=2r, with rbeing the radius of the glass end section as defined by the optical fiber cladding. The glass end section has a radius rless than 45 microns, allowing for a high-density FAU and a high-density optical interconnection device.