The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Apr. 07, 2020
Applicant:
The University of Chicago, Chicago, IL (US);
Inventors:
Henry J. Frisch, Chicago, IL (US);
Evan Angelico, San Marcos, CA (US);
Andrey Elagin, Bolingbrook, IL (US);
Eric Spieglan, Lisle, IL (US);
Assignee:
The University of Chicago, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); G01T 1/17 (2006.01); H01L 31/0203 (2014.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
G01T 1/17 (2013.01); H01L 31/0203 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); H05K 5/062 (2013.01); H05K 5/063 (2013.01); H05K 5/069 (2013.01);
Abstract
Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.