The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

May. 16, 2017
Applicants:

Denso Corporation, Kariya, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Norio Gouko, Kariya, JP;

Toshihisa Taniguchi, Kariya, JP;

Atusi Sakaida, Kariya, JP;

Keiji Okamoto, Kariya, JP;

Yoshihiko Shiraishi, Kariya, JP;

Masahiro Asano, Kariya, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 17/00 (2006.01); G01N 25/18 (2006.01); G01K 17/20 (2006.01);
U.S. Cl.
CPC ...
G01N 25/18 (2013.01); G01K 17/20 (2013.01);
Abstract

A heat flow measurement apparatus is provided with a heat flux sensor and a thermocouple sheet. The heat flux sensor includes an insulation substrate, a plurality of interlayer connection members, a front surface wiring pattern, a back surface wiring pattern, a front surface protective member and a back surface protective member. The thermocouple sheet includes a thermocouple, a first insulation sheet and a second insulation sheet, and is fixed to a portion where the front surface protective member and the back surface protective member extend in a surface direction from the insulation substrate.


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