The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Jan. 09, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Guanghua Wang, Clifton Park, NY (US);

Naveenan Thiagarajan, Latham, NY (US);

Todd Garrett Wetzel, Niskayuna, NY (US);

Jason Edward Dees, Ballston Lake, NY (US);

Bernard Patrick Bewlay, Niskayuna, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 1/00 (2006.01); G01J 1/02 (2006.01); F02C 7/12 (2006.01); G01J 5/04 (2006.01); G01J 5/06 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
G01J 1/0252 (2013.01); F02C 7/12 (2013.01); G01J 5/0088 (2013.01); G01J 5/042 (2013.01); G01J 5/046 (2013.01); G01J 5/049 (2013.01); G01J 5/061 (2013.01); F05D 2260/207 (2013.01); F05D 2270/112 (2013.01); F05D 2270/804 (2013.01); G01J 2005/0077 (2013.01);
Abstract

An infrared imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.


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