The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Feb. 22, 2019
Applicants:
Dow Silicones Corporation, Midland, MI (US);
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
Steven Swier, Midland, MI (US);
Glenn Gordon, Midland, MI (US);
Zachary Kean, Bay City, MI (US);
Michael Behr, Midland, MI (US);
John Bernard Horstman, Midland, MI (US);
Assignees:
DOW SILICONES CORPORATION, Midland, MI (US);
DOW GLOBAL TECHNOLOGIES LLC, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/10 (2006.01); C08F 8/22 (2006.01); C08F 8/42 (2006.01); C08G 77/12 (2006.01); C08G 77/442 (2006.01); C09J 183/14 (2006.01);
U.S. Cl.
CPC ...
C09J 183/10 (2013.01); C08F 8/22 (2013.01); C08F 8/42 (2013.01); C08G 77/12 (2013.01); C08G 77/442 (2013.01); C09J 183/14 (2013.01); C08F 2410/01 (2013.01);
Abstract
A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.