The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Apr. 25, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Li Yao, Woodbury, MN (US);

Rajdeep S. Kalgutkar, Woodbury, MN (US);

Mario A. Perez, Burnsville, MN (US);

Wayne S. Mahoney, St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C09J 163/00 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.


Find Patent Forward Citations

Yao, Li. (2021). Curable and cured compositions (U.S. Patent No. 11193016). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11193016

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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