The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2021

Filed:

Oct. 09, 2019
Applicant:

Safran Electronics & Defense, Paris, FR;

Inventors:

Jean-Christophe Riou, Paris, FR;

Nawres Sridi-Convers, Paris, FR;

Eric Bailly, Paris, FR;

Assignee:

SAFRAN ELECTRONICS & DEFENSE, Boulogne-Billancourt, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 3/00 (2006.01); G01L 19/00 (2006.01); G01L 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 3/001 (2013.01); G01L 19/0061 (2013.01); G01L 19/04 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81C 2203/035 (2013.01);
Abstract

A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.


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