logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11192351 B1

PDFFull Text
Date of Patent:
Dec. 07, 2021

Filed:

Dec. 19, 2018

Peel ply for surface preparation and bonding method using the same

Applicant:

Cytec Industries Inc., Princeton, NJ (US);

Inventors:

Leonard Macadams, Woolwich Township, NJ (US);

Dalip K. Kohli, Churchville, MD (US);

Assignee:

CYTEC INDUSTRIES INC., Princeton, NJ (US);

Attorney:

Thi Dang

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
B32B 5/00 (2006.01); B32B 7/00 (2019.01); B32B 27/00 (2006.01); B32B 37/00 (2006.01); B29C 65/00 (2006.01); B32B 37/02 (2006.01); B32B 5/02 (2006.01); B32B 7/06 (2019.01); B32B 27/38 (2006.01); B32B 27/12 (2006.01); B29C 65/48 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 37/02 (2013.01); B29C 65/48 (2013.01); B29C 65/483 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/026 (2013.01); B32B 7/06 (2013.01); B32B 27/12 (2013.01); B32B 27/38 (2013.01); B32B 37/12 (2013.01); B32B 2037/1253 (2013.01); B32B 2262/0276 (2013.01); B32B 2264/10 (2013.01); B32B 2307/718 (2013.01); B32B 2307/732 (2013.01);
Abstract

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

Find Patent Forward Citations

Loading…