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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11192187 B1

PDFFull Text
Date of Patent:
Dec. 07, 2021

Filed:

Mar. 09, 2016

Additive manufacturing device utilizing eb-laser composite scan

Applicant:

Tsinghua University, Beijing, CN;

Inventors:

Feng Lin, Beijing, CN;

Bin Zhou, Beijing, CN;

Chao Guo, Beijing, CN;

Wenjun Ge, Beijing, CN;

Lei Zhang, Beijing, CN;

Assignee:

Tsinghua University, Beijing, CN;

Attorney:

Houtteman Law LLC

Primary Examiner:

Joseph S Del Sole

Assistant Examiner:

John Robitaille

Int. Cl.
CPC ...
B22F 10/20 (2021.01); B29C 64/153 (2017.01); B28B 1/00 (2006.01); B29C 64/371 (2017.01); H01J 37/22 (2006.01); B33Y 30/00 (2015.01); B23K 26/082 (2014.01); B23K 26/12 (2014.01); B23K 26/342 (2014.01); B23K 15/00 (2006.01); B23K 26/046 (2014.01); B28B 17/00 (2006.01); B22F 10/30 (2021.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B23K 15/002 (2013.01); B23K 15/004 (2013.01); B23K 15/0086 (2013.01); B23K 26/046 (2013.01); B23K 26/082 (2015.10); B23K 26/1224 (2015.10); B23K 26/342 (2015.10); B28B 1/00 (2013.01); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 64/153 (2017.08); B29C 64/371 (2017.08); B33Y 30/00 (2014.12); H01J 37/228 (2013.01); B22F 10/30 (2021.01); B22F 2999/00 (2013.01); B33Y 50/02 (2014.12); H01J 2237/30483 (2013.01); Y02P 10/25 (2015.11);
Abstract

An additive manufacturing device utilizing an electron beam and laser integrated scanning comprises: a vacuum generating chamber (); a worktable means having a forming region at least provided in the vacuum generating chamber (); a powder supply means configured to supply a powder to the forming region; an electron-beam emission focusing and scanning means () and an laser-beam emission focusing and scanning means () configured in such a manner that a scanning range of the electron-beam emission focusing and scanning means () and a scanning range of the laser-beam emission focusing and scanning means () cover at least a part of the forming region; and a controller configured to control the electron-beam emission focusing and scanning means () and the laser-beam emission focusing and scanning means () to perform a powder integrated-scanning and forming treatment on the forming region.

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