The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Oct. 15, 2019
Applicant:

Deere & Company, Moline, IL (US);

Inventors:

Christopher J. Schmit, Fargo, ND (US);

Andrew Schefter, Fargo, ND (US);

William F. Cooper, Fargo, ND (US);

Assignee:

Deere & Company, Moline, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/427 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20309 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/2039 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20936 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10166 (2013.01);
Abstract

An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.


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