The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Oct. 09, 2019
Applicant:
Ethertronics, Inc., San Diego, CA (US);
Inventors:
Seung Hyuk Choi, Gyeonggi-do, KR;
Hyun Jun Hong, Gyeonggi-do, KR;
Tae Wook Kim, Gyeonggi-do, KR;
Cheong Ho Ryu, Gyeonggi-do, KR;
Young Sang Kim, Gyeonggi-do, KR;
Sung Jun Kim, Gyeonggi-do, KR;
Assignee:
ETHERTRONICS, INC., San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/18 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0026 (2013.01); H05K 3/0014 (2013.01); H05K 3/185 (2013.01); H05K 3/188 (2013.01); H05K 3/28 (2013.01); H05K 3/423 (2013.01); H05K 3/4644 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/0582 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/072 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract
The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.