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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11191161 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Jul. 28, 2020

Electronic circuit

Applicants:

Denso Corporation, Kariya, JP;

Tyco Electronics Japan G.k., Kawasaki, JP;

Inventors:

Shiro Koide, Kariya, JP;

Daisuke Dobashi, Tokyo, JP;

Yohei Sakurai, Fujisawa, JP;

Assignees:

DENSO CORPORATION, Kariya, JP;

TYCO ELECTRONICS JAPAN G.K., Kawasaki, JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H01R 12/51 (2011.01); H01R 12/52 (2011.01); H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/50 (2006.01); H01Q 9/40 (2006.01); H01Q 9/42 (2006.01); H01Q 1/12 (2006.01); H01Q 1/36 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/14 (2013.01); H01Q 1/12 (2013.01); H01Q 1/36 (2013.01); H05K 3/341 (2013.01); H05K 3/36 (2013.01); H05K 2201/10 (2013.01);
Abstract

An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.

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