The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Jan. 08, 2020
Applicant:

Giga-byte Technology Co., Ltd., New Taipei, TW;

Inventors:

Yuan-Li Chien, New Taipei, TW;

Yen-Yun Chang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/10 (2006.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H01R 12/73 (2013.01); H05K 7/10 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10409 (2013.01);
Abstract

A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.


Find Patent Forward Citations

Chien, Yuan-Li. (2021). Heat dissipation assembly of m.2 expansion card and electronic device (U.S. Patent No. 11191149). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11191149

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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