The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Jul. 07, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Haim Mendel Weissman, Haifa, IL;

Lior Raviv, Poole, IL;

Xiaoyin He, San Diego, CA (US);

Vladimir Aparin, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/00 (2006.01); H04B 15/00 (2006.01); H04W 72/04 (2009.01); H04B 1/40 (2015.01); H04B 7/06 (2006.01);
U.S. Cl.
CPC ...
H04B 1/0064 (2013.01); H04B 1/40 (2013.01); H04B 7/0695 (2013.01); H04W 72/0453 (2013.01);
Abstract

Methods, systems, and devices are described for transceiver architecture for millimeter wave wireless communications. A device may include two transceiver chip modules configured to communicate in different frequency ranges. The first transceiver chip module may include a baseband sub-module, a first radio frequency front end (RFFE) component and associated antenna array. The second transceiver chip module may include a second RFFE component and associated antenna array. The second transceiver chip module may be separate from the first transceiver chip module. The second transceiver chip module may be electrically coupled to the baseband sub-module of the first transceiver chip module.


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