The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

May. 26, 2020
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Stephane Richard Marie Wloczysiak, Irvine, CA (US);

Phi Nguyen Dang, Irvine, CA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/00 (2006.01); H04B 1/12 (2006.01); H04B 1/7075 (2011.01); H04M 11/06 (2006.01); H04L 5/02 (2006.01); H04L 5/00 (2006.01); H04B 1/48 (2006.01);
U.S. Cl.
CPC ...
H04B 1/001 (2013.01); H04B 1/005 (2013.01); H04B 1/0017 (2013.01); H04B 1/0057 (2013.01); H04B 1/126 (2013.01); H04B 1/48 (2013.01); H04B 1/7075 (2013.01); H04L 5/001 (2013.01); H04L 5/0098 (2013.01); H04L 5/026 (2013.01); H04M 11/062 (2013.01);
Abstract

Described herein are systems configured for carrier aggregation. Systems include a multiplexing circuit having a filter assembly, switching circuit with a switching path, and a switchable impedance. The filters can be designed so that when operated simultaneously (e.g., during multi-band operation) the same inductance can be used allowing the switching network to switch in a particular inductance into the path. The described systems can include an inductance that is coupled to an output port so that when operating in single-band mode, the different paths share the same inductance. Relative to other solutions, the described systems can improve performance (e.g., reduce insertion loss), reduce the number of components in the associated module, reduce manufacturing costs, and the like.


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