The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Apr. 16, 2020
Applicant:

Tubis Technology Inc., Pasadena, CA (US);

Inventor:

James Wang, Pasadena, CA (US);

Assignee:

Tubis Technology Inc., San Diego, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 3/26 (2006.01); H01Q 21/00 (2006.01); H01Q 3/28 (2006.01); H01Q 25/04 (2006.01); H04B 7/06 (2006.01); H01Q 3/34 (2006.01);
U.S. Cl.
CPC ...
H01Q 3/2617 (2013.01); H01Q 3/28 (2013.01); H01Q 3/34 (2013.01); H01Q 25/04 (2013.01); H04B 7/0617 (2013.01);
Abstract

A low-cost implementation and a simplified digital signal control and synchronization for a multi-beam phased-array antenna is proposed. In a preferred embodiment, the multi-beam phased array antenna is implemented with a stack-up comprises 1) an antenna substrate aperture containing embedded antenna elements and a third layer of the signal combiner/divider and distribution network, 2) interposer substrate providing a second layer of the signal combiner/divider and distribution network and the carrier of BPU ICs, and 3) the BPU ICs containing the plurality of phased-array frontend processing unit and a first layer of the signal combiner/divider and distribution unit. In one advantageous aspect, the invention is to combine the third layer of the signal combiner/divider and distribution network with the antenna onto the same substrate, eliminating the use of expensive miniature high frequency connectors.


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