The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Feb. 25, 2020
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Hideyo Nakamura, Matsumoto, JP;

Motohito Hori, Matsumoto, JP;

Yuki Inaba, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/053 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/053 (2013.01); H01L 23/49 (2013.01); H01L 23/498 (2013.01); H01L 25/072 (2013.01);
Abstract

A semiconductor device includes circuit substratesandincluding circuit pattern layers, a semiconductor elementmounted to the circuit pattern layer, a connecting pinconnecting the semiconductor elementto the circuit pattern layer, a pin-shaped terminalconnected to the circuit pattern layer, a sealing membersealing the circuit substratesand, the semiconductor element, and the connecting pin, and an external terminalincluding a flat plate portionand an extending portionbent from the flat plate portionand extends away from the circuit substrate, in which the flat plate portionis connected to the pin-shaped terminaland arranged in parallel with the circuit pattern layer, and the extending portionis provided in a range of a width in a transverse direction of the sealing member


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