The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Oct. 01, 2019
Fuji Electric Co., Ltd., Kanagawa, JP;
Satoshi Kaneko, Nagano, JP;
Naoyuki Kanai, Nagano, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
A semiconductor module internally includes semiconductor elements and multilayer substrates on which the semiconductor elements are arranged. The semiconductor module further includes, in a case, fastening portions for fastening a cooler such as conductive radiating fins or water-cooling jackets, for example. In the semiconductor module, side faces of heat radiating plates formed on the rear surface sides of the multilayer substrates are electrically connected to the fastening portions in the case by conductive connectors.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile