The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Mar. 07, 2020
Applicant:

Rising Technologies Co., Ltd., Yokohama, JP;

Inventor:

Shuzo Akejima, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/4658 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/214 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H05K 2203/1322 (2013.01); H05K 2203/1453 (2013.01);
Abstract

The electronic circuit device according to the present invention including the wiring layerincluding a plurality of the metal wirings, the photosensitive resin layermade of the photosensitive resin arranged on the wiring layer, and the first electronic circuit elementarranged in the photosensitive resin layer. In this electronic circuit device, a plurality of openingfor exposing a part of the wiring layeris formed on the photosensitive resin layer, and further, together with three-dimensionally connected to the first electronic circuit element, the re-distribution layeron the first electronic circuit element including a plurality of the metal wirings which is three-dimensionally connected via a plurality of openings to a part of the wiring layer, and the first external connection terminalconnected to the re-distribution layerare formed.


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Akejima, Shuzo. (2021). Electronic circuit device and method of manufacturing electronic circuit device (U.S. Patent No. 11189571). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11189571

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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