The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Jun. 20, 2019
Nanya Technology Corporation, New Taipei, TW;
Chiang-Lin Shih, Taipei, TW;
Pei-Jhen Wu, Taipei, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
A semiconductor device includes a plurality of first semiconductor dies, a first adhesive layer, a plurality of second semiconductor dies, a second adhesive layer, and a plurality of first metal bumps. The first semiconductor dies are embedded in a first photosensitive layer of a first group of wafers. The first adhesive layer is disposed between at least two of the first group of wafers to form a first structure. The second semiconductor dies are embedded in a second photosensitive layer of a second group of wafers. The second adhesive layer is disposed between at least two of the second group of wafers to form a second structure. The first metal bumps are disposed between the first structure and second structure, in which the first structure is connected to the second structure with the first metal bumps.