IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11189544 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Feb. 05, 2020

Plurality of cooling tubes with coolant for a power conversion package

Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Hiroki Matsuzawa, Kariya, JP;

Bahman Hossini Soltani, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H01L 23/46 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/00 (2006.01); H01L 23/473 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/46 (2013.01); H01L 21/4871 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/49537 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H01L 25/117 (2013.01); H01L 25/50 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01);
Abstract

A power conversion apparatus includes a semiconductor element, a plurality of lead frames, a flow-passage formation body, an insulating portion, a metal joining material, and a resin sealing portion. The plurality of lead frames are electrically connected to the semiconductor element. The flow-passage formation body forms a coolant flow passage in which a coolant flows. The insulating portion is arranged between the lead frame and the flow-passage formation body to provide insulation between the lead frame and the flow-passage formation body. The metal joining material joins the insulating portion and the flow-passage formation body. The resin sealing portion seals the semiconductor element and the lead frames. The semiconductor element and the lead frames are integrated with the flow-passage formation body to form a semiconductor cooling assembly by the resin sealing portion.

Find Patent Forward Citations

Loading…