logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11187982 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Oct. 09, 2019

Photosensitive resin composition, photosensitive dry film, and pattern forming process

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Hitoshi Maruyama, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/30 (2006.01); G03F 7/38 (2006.01); G03F 7/085 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); G03F 7/0751 (2013.01); G03F 7/085 (2013.01); G03F 7/30 (2013.01); G03F 7/40 (2013.01); G03F 7/38 (2013.01);
Abstract

A photosensitive resin composition comprising (A) a silicone resin containing an epoxy and/or phenolic hydroxyl group, (B) a photoacid generator, and (C) a cure promoter selected from diazabicycloundecene, diazabicyclononene, an organic salt of diazabicycloundecene derivative, and an organic salt of diazabicyclononene derivative is shelf stable. A photosensitive resin coating obtained therefrom may be processed to form a fine size pattern. The resin coating has improved film properties including chemical resistance, adhesion to substrates, mechanical properties, electric insulation, and copper migration resistance, and is thus fully reliable as an insulating protective film.

Find Patent Forward Citations

Maruyama, Hitoshi. (2021). Photosensitive resin composition, photosensitive dry film, and pattern forming process (U.S. Patent No. 11187982). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11187982

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…