The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Jan. 24, 2019
Applicant:

Kelvin Innovations Llc, Madison, WI (US);

Inventor:

Yiyan Peng, Madison, WI (US);

Assignee:

Kelvin Innovations LLC, Madison, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 11/02 (2006.01); G01B 7/16 (2006.01); G01L 1/14 (2006.01); G01N 11/00 (2006.01);
U.S. Cl.
CPC ...
G01N 11/02 (2013.01); G01B 7/22 (2013.01); G01L 1/142 (2013.01); G01N 2011/0033 (2013.01); G01N 2203/0094 (2013.01); G01N 2203/0617 (2013.01);
Abstract

A method for detecting components of dielectric materials is disclosed. The method includes use of a sensor to obtain at least one of a strain-dielectric coefficient data series at multiple frequencies or a stress-dielectric coefficient data series at multiple frequencies and using a processor to analyze resulting data, when a strain field or a stress field is known. The method also includes use of a sensor to obtain rheo-dielectric coefficient data at single frequency or data series at multiple frequencies and using a processor to analyze resulting data, when shear rate is known. The resulting data is used to perform material process or operation monitoring and control, quality examination, and characterization. Systems for detecting components of dielectric materials and for dielectrostriction measurement are also disclosed.


Find Patent Forward Citations

Peng, Yiyan. (2021). Dielectrostriction measurement with electrical excitation frequency sweep method and rheo-dielectric coefficient for process monitoring, quality examination, and material characterization (U.S. Patent No. 11187636). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11187636

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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