The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Mar. 06, 2019
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

John Patrick Bergen, San Jose, CA (US);

Daryl G. James, Coquitlam, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); G01K 11/32 (2021.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H02N 13/00 (2006.01);
U.S. Cl.
CPC ...
G01K 11/32 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H02N 13/00 (2013.01);
Abstract

An assembly, for example an electrostatic chuck assembly, includes a first member, a second member disposed proximate the first member, a bond layer disposed between the first member and the second member, and at least one optical sensor disposed proximate the bond layer to detect a temperature of the bond layer in a field of view of the at least one optical sensor. The bond layer includes a phosphorescent material and provides a dual function of bonding the second member to the first member and emitting phosphorescent radiation towards the at least one optical sensor. In one form, the first member is an electrostatic chuck member and the second member is a heating plate. The assembly may further include a cooling plate and an additional bond layer disposed between the heating plate and the cooling plate.


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