The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Aug. 08, 2018
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Jochen Reinmuth, Reutlingen, DE;

Robert Maul, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01C 19/5747 (2012.01); G01C 19/5762 (2012.01); G01C 19/5712 (2012.01); B81B 3/00 (2006.01); G01C 19/5769 (2012.01); G01C 19/5783 (2012.01);
U.S. Cl.
CPC ...
G01C 19/5712 (2013.01); B81B 3/0051 (2013.01); B81B 3/0072 (2013.01); G01C 19/5747 (2013.01); G01C 19/5762 (2013.01); G01C 19/5769 (2013.01); G01C 19/5783 (2013.01); B81B 2203/058 (2013.01);
Abstract

A rotation rate sensor including a substrate, a drive structure, which is movable with regard to the substrate, a detection structure, and a Coriolis structure, the drive structure, the Coriolis structure, and the detection structure being essentially situated in a layer, in that an additional layer is situated essentially in parallel to the layer above or underneath the layer, a mechanical connection between the Coriolis structure and the drive structure being established with a first spring component, the first spring component being configured as a part of the additional layer, and/or a mechanical connection between the detection structure and the substrate being established with a second spring component, the second spring component being configured as a part of the additional layer.


Find Patent Forward Citations

Loading…