The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Aug. 21, 2019
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

David deKoninck, Brossard, CA;

Varun Subramaniam Kumar, San Jose, CA (US);

Matthew Julian Thompson, Beaverton, OR (US);

Vadim Tsinker, Belmont, CA (US);

Logeeswaran Veerayah Jayaraman, Milpitas, CA (US);

Sarah Nitzan, Palo Alto, CA (US);

Houri Johari-Galle, San Jose, CA (US);

Jongwoo Shin, Pleasanton, CA (US);

Le Jin, Fremont, CA (US);

Assignee:

INVENSENSE, INC., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L 19/04 (2006.01); G01K 1/20 (2006.01); B81B 7/00 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0019 (2013.01); B81B 7/0087 (2013.01); G01K 1/20 (2013.01); G01L 9/0072 (2013.01); G01L 19/04 (2013.01); B81B 2201/0242 (2013.01);
Abstract

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.


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