The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Jul. 08, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Kristopher Allen Wieland, Painted Post, NY (US);

Garrett Andrew Piech, Corning, NY (US);

John Tyler Keech, Painted Post, NY (US);

Jeffrey Mathew Clark, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 17/06 (2006.01); B23K 26/53 (2014.01); C03C 15/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); C03B 33/02 (2006.01); C03C 17/06 (2006.01); B23K 26/06 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B23K 26/0604 (2013.01); B23K 26/53 (2015.10); B32B 17/06 (2013.01); C03B 33/0222 (2013.01); C03C 15/00 (2013.01); C03C 17/06 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); B23K 2103/54 (2018.08); B32B 2307/412 (2013.01); Y02P 40/57 (2015.11);
Abstract

Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.


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