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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11185918 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Jun. 30, 2016

Self-aligning metal patterning based on photonic sintering of metal nanoparticles

Applicant:

National Research Council of Canada, Ottawa, CA;

Inventors:

Zhiyi Zhang, Ottawa, CA;

Ye Tao, Ottawa, CA;

Ta-Ya Chu, Ottawa, CA;

Gaozhi Xiao, Ottawa, CA;

Assignee:

NATIONAL RESEARCH COUNCIL OF CANADA, Ontario, CA;

Attorney:

Wegman Hessler

Primary Examiner:

Patricia L Hailey

Assistant Examiner:

Christopher D Moody

Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 3/24 (2006.01); B22F 5/00 (2006.01); B22F 7/04 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); B82Y 20/00 (2011.01);
U.S. Cl.
CPC ...
B22F 7/04 (2013.01); B22F 3/105 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); G03F 7/0043 (2013.01); G03F 7/2014 (2013.01); G03F 7/2022 (2013.01); G03F 7/40 (2013.01); B22F 2003/247 (2013.01); B22F 2003/248 (2013.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B82Y 20/00 (2013.01); H01L 51/0022 (2013.01); H01L 51/0023 (2013.01); H01L 51/0096 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01); H01L 2251/301 (2013.01); H05K 1/097 (2013.01); H05K 3/06 (2013.01); H05K 3/064 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0145 (2013.01); H05K 2203/013 (2013.01); H05K 2203/0548 (2013.01); H05K 2203/0766 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.

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