The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2021

Filed:

Jan. 17, 2019
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Yuki Horinouchi, Isehara, JP;

Mitsuo Takada, Kanzaki-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21C 1/02 (2006.01); B21C 3/02 (2006.01); C22C 5/04 (2006.01); C23C 30/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
B21C 1/02 (2013.01); B21C 3/025 (2013.01); C22C 5/04 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01B 1/02 (2013.01); Y10T 428/2958 (2015.01);
Abstract

A platinum-based material element wire is coated with gold or gold alloy, and drawing-processed with a carbon-containing die. The thin wire manufactured in this manner is covered with gold or gold alloy, and the coverage of gold or gold alloy is 40% or more on an area basis. The thin wire formed of a platinum-based material is manufactured in a state of suppressing breakage in a drawing processing step, and has favorable performance in electric properties and the like. In addition, this manufacturing process is capable of efficiently manufacturing a platinum-based material thin wire while suppressing breakage when the thin wire is manufactured by drawing processing.


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