The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2021

Filed:

Jul. 31, 2019
Applicant:

Ckd Corporation, Aichi, JP;

Inventors:

Manabu Okuda, Aichi, JP;

Tsuyoshi Ohyama, Aichi, JP;

Norihiko Sakaida, Aichi, JP;

Assignee:

CKD CORPORATION, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B23K 1/00 (2006.01); B23K 3/00 (2006.01); H05K 3/34 (2006.01); G06T 7/70 (2017.01); B23K 1/005 (2006.01); G01B 11/24 (2006.01); G06T 7/00 (2017.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); B23K 1/005 (2013.01); B23K 1/0016 (2013.01); G01B 11/24 (2013.01); G06T 7/001 (2013.01); G06T 7/0006 (2013.01); G06T 7/70 (2017.01); B23K 2101/42 (2018.08); G06T 2207/30141 (2013.01); G06T 2207/30152 (2013.01); H05K 2203/048 (2013.01); H05K 2203/166 (2013.01);
Abstract

A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.


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